MIM heat dissipation copper plate is a high-precision copper-based heat dissipation component prepared by metal powder injection molding (Metal Injection Molding) process, which can achieve complex special-shaped structure design that cannot be completed by traditional machining, taking into account the ultra-high thermal conductivity of copper and the high-precision mass production advantages of MIM process. It is the core heat dissipation solution in high power density scenarios.

mainstream application scenarios

New energy and automotive fields: Adapted to power battery pack heat dissipation plates and on-board power electronic device heat dissipation bases, the battery temperature rise under continuous fast charging conditions can be reduced from 42 ° C to 36.5 ° C, prolonging the battery cycle life by about 30%.

High-power electronic scenarios: used in heat dissipation substrates for 1.6T OSFP optical modules, semiconductor lasers, and radio frequency chips, some tungsten-copper composite MIM heat dissipation copper plates can also achieve accurate matching of thermal expansion coefficients with GaN and GaAs semiconductor substrates.

In the field of high-end equipment: in industrial automation dispensing equipment and AI hardware computing power modules, the extreme heat dissipation problem with local heat flux exceeding 100W/cm ² is solved, and the long-term stable operation of the equipment is supported.