The material utilization rate of the MIM process exceeds 95%, with almost no waste; the utilization rate of the traditional aluminum alloy solution is less than 60%.
One-piece forming reduces assembly processes, cuts labor costs by 40%, and avoids high yield loss caused by multi-step procedures.
The excellent thermal conductivity of pure copper reduces the supporting cost of the liquid cooling system and significantly lowers the module failure rate.
One-time mold forming, mature process, product yield stably above 98%, capable of achieving a monthly production scale of millions of units.
The integrated structure has no welding points and assembly gaps, completely avoiding the common risks of poor contact and cold solder joints in traditional solutions.
Pure Copper: 380-400 W/(m·K) | Aluminum Alloy: 160-200 W/(m·K).
Advantages: Thermal conductivity efficiency is increased by 75%-140%, and the heat transfer speed is doubled.
Pure Copper: Excellent CTE matching | Aluminum Alloy: Large CTE mismatch, prone to failure.
Advantage: MTBF is increased by more than 30%, significantly reducing long-term operation and maintenance costs.
