The core role of the MIM process copper plate in the optical module is to solve the thermal management bottleneck in high-power scenarios such as 800G/1.6T, while taking into account the needs of precision structural support and electromagnetic shielding. It replaces traditional zinc alloy and aluminum alloy components and becomes the core guarantee for the stable operation of high-speed optical modules.
Core cooling function
Full-module thermal conductivity upgrade: directly replace the traditional zinc alloy optical module shell, the thermal conductivity of copper-based MIM parts can reach 390W/m · K or more, which is 2 to 3 times that of zinc alloy, and can reduce the overall temperature rise of 1.6T optical module by 5~ 10 ℃. Avoid the problem of wavelength drift and signal error bit rate soaring due to overheating of DSP chips and lasers.
Partial hot spot precise dredging: integrally formed dense heat dissipation pin post, micro-channel structure, as the exclusive heat sink of DSP chip, the local heat flux density of more than 100W/cm ² concentrated heat quickly diffuses, thermal resistance is reduced by more than 20% compared with traditional machined copper plate, adapting to the extreme heat dissipation requirements of 1.6T and above high-power modules.
Liquid cooling scene adaptation: The MIM process can be integrated to form a complex microchannel cold plate with an internal closure, completely eliminating the hidden danger of weld leakage in the traditional welding process. There is no flux residue inside the flow channel, and the cleanliness is higher. It is suitable for data center immersion liquid cooling and rack cold plate liquid cooling scenarios, supporting the power density of the cabinet to increase from 15kW to 45kW.
Floating heat dissipation anti-card lag: equipped with an independent floating structure of MIM copper cold plate, through the spring balance design, it can not only closely fit with the optical module shell to balance heat conduction, but also effectively avoid the problem of insertion card lag when the optical module is hot-swappable, greatly improving operation and maintenance efficiency.
Additional structure and electromagnetic performance advantages
Precision structure integrated molding: a special-shaped heat dissipation copper plate with chutes, buckles, and positioning grooves is injected at one time, without the need for multi-component machining and assembly. The dimensional tolerance is controlled within ± 0.1% to ensure the alignment accuracy of the internal optical axis of the optical module and avoid excessive optical signal insertion loss caused by assembly deviation.
Electromagnetic shielding enhancement: The copper-based material itself has excellent electromagnetic shielding performance, which can block external electromagnetic interference from invading the interior of the optical module while exporting heat, ensuring the transmission purity of high-speed signals of 224G and above, and adapting to the high-interference operating environment of AI servers.
Mass production reduces costs and increases efficiency: Compared with traditional machined copper plates, the MIM process can reduce the production cost of complex special-shaped parts by more than 55%, and the consistency is higher in mass production. The yield is much higher than that of 3D printed copper parts, perfectly matching the annual shipment demand of 10 million optical modules.
