The MIM copper plate has formed a multi-scene mass production landing case in the optical module, covering core scenarios such as 800G/1.6T mainstream digital optical module and liquid-cooled optical module. The leading manufacturers have realized the whole process from laboratory verification to batch supply.
Mass production case of 1.6T MIM copper alloy optical module shell
Landing scene: directly replace the traditional zinc alloy shell, applied to 1.6T OSFP high-power digital optical module, is the first project in China to achieve mass production of MIM copper alloy optical module shell, the product specification has been iterated from 800G to 1.6T. It has been officially transferred to the batch supply stage in 2026.
Core technology breakthrough: By customizing the copper alloy powder formula, the industry pain points of pure copper being soft and prone to deformation due to frequent plugging and unplugging have been solved. While maintaining a high thermal conductivity of 390W/m · K or more, the hardness and wear resistance of components have been greatly improved, and the hot-swappable life of optical modules has been increased by more than 3 times.
Measured effect: Compared with the traditional zinc alloy shell, the overall temperature rise of the module is reduced by 5~ 10 ° C, which completely solves the hot spot problem of 1.6T optical module DSP chip with local heat flux exceeding 100W/cm ², and the signal error bit rate is reduced by more than 40%. It has now entered the core supply chain of leading AI optical module manufacturers.
MIM integrated liquid-cooled light module microchannel cold plate case
Landing scenario: It is applied to the data center rack-type cold plate liquid-cooled optical module, replacing the traditional brazing splicing copper cold plate. At present, it has achieved batch supply in energy storage and edge computing server scenarios.
The core technology breakthrough: The MIM process directly integrates the internal enclosed complex micro-flow channel, completely eliminating the hidden danger of weld leakage in the traditional welding process, no flux residue inside the flow channel, and greatly improving the cleanliness. This completely solves the long-standing pain points of the traditional liquid-cooled board.
Measured results: The power density of the support cabinet has been increased from 15kW to 45kW, the liquid cooling system has no risk of leakage for long-term operation, and the overall thermal resistance of the cold plate is reduced by 20% compared with the traditional welding process. It is suitable for the extreme heat dissipation requirements of the high-power optical module of the AI computing power cluster.
Heat dissipation case of MIM copper cold plate optical module with floating structure
Landing scene: Applied to a hot-swappable high-speed optical module cage (Cage) cooling system, equipped with an independent floating MIM copper cold plate, the related technology has applied for a number of invention patents and been authorized.
Core technology breakthrough: MIM process integrated molding with built-in spring balanced design of independent floating cold plate unit, no additional assembly of multiple parts, dimensional tolerance control within ± 0.1%, to solve the traditional machining copper plate can not achieve integrated floating structure forming problems.
Measured results: The fit between the cold plate and the optical module shell is increased by 90%, the contact thermal resistance is greatly reduced, and the insertion delay problem during the hot-swapping of the optical module is completely avoided. The operation and maintenance efficiency is increased by more than 2 times. It has now entered the verification stage of many leading data center customers.
